Function introduction for thick film printing

Thick film printing technology uses screen or stencil printing to print ink materials such as conductors, resistors, and insulation on the surface of the substrate. According to the application of different industries, the substrates used can be divided into various materials such as ceramics, aluminum nitride, and enamel. Among them, the ceramic substrate is the most commonly used material for thick film printing. Because the ceramic substrate itself has good heat conduction and heat resistance properties, it is often used in products with high heat generation and high energy.

The material used for thick film printing is a special paste that must possess the following three properties.
1. Printability – The dye needs to have a certain viscosity, and the viscosity decreases with the shear force applied by the squeegee, and it has thixotropy.
2. Functional characteristics – characteristics required as resistors, conductors, dielectrics, etc.
3. Process compatibility: The paste and the substrate have good adhesion properties. When various pastes are used together, there will be no adverse reactions between them during the entire process.

* Size reduction: At least 0.7 times smaller than traditional PCB.
* High Confidentiality: The encapsulation operation improves the confidentiality.
* Fast research and development speed (3-6 weeks), low research and development cost.
* Heat resistance, good heat dissipation: low noise, suitable for high frequency, high reliability.
* High power and high pressure resistance can be designed.

Products like Favor are used in automotive electronics, and we can often find our traces, because such products are commonly used in rearview mirror adjustment, car seat adjustment, air conditioning adjustment, etc., which are commonly used in automotive electronics.